The Effect of Pulsed Current and Organic Additives on the Hydrogen Incorporation in Electroformed Copper Used in High Vacuum Applications
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| Titre | The Effect of Pulsed Current and Organic Additives on the Hydrogen Incorporation in Electroformed Copper Used in High Vacuum Applications |
| Type de publication | Conference Paper |
| Year of Publication | 2018 |
| Auteurs | L. Amador L, Rolet J., Doche M-L, Massuti-Ballester P., Gigandet M-P, Moutarlier V., Taborelli M., Ferreira L.MA, Chiggiato P., Hihn J-Y |
| Conference Name | SELECTED PROCEEDINGS FROM THE 233RD ECS MEETING |
| Publisher | Electrochem Soc |
| Conference Location | 65 S MAIN ST, PENNINGTON, NJ 08534-2839 USA |
| ISBN Number | 978-1-60768-841-9 |
| Résumé | The presence and influence of hydrogen on electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit the H-2 formation and allows using higher cathodic pulses before the starting of the copper diffusion limited range. TDS experiments show the release of hydrogen trapped into the copper under two different forms. Hydrogen diffused from copper vacancies was found on all samples at an outgassing temperature around 450 degrees C. For samples with long pulse times, an additional H-2 outgassing peak was found around 600 degrees C. XRD measurements allowed us to determine the preferential orientation of the plated samples and to monitor the lattice parameter evolution with increasing temperature. |
| DOI | 10.1149/08513.0815ecst |