Analysis of Forces during UV Glue Curing for Micro-Assembly Applications
| Affiliation auteurs | !!!! Error affiliation !!!! |
| Titre | Analysis of Forces during UV Glue Curing for Micro-Assembly Applications |
| Type de publication | Conference Paper |
| Year of Publication | 2019 |
| Auteurs | Tiwari B, Clevy C, Lutz P |
| Editor | Juillard J, Lefeuvre E, Mailly F, Mita Y, Nouet P, Pressecq F, Schneider P, Smith S |
| Conference Name | SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP 2019) |
| Publisher | IEEE; LIRMM; C2N; Genie Electrique & Electronique Paris; CNRS; Nextron; IEEE Elect Packaging Soc; Coventor; CentraleSupelec |
| Conference Location | 345 E 47TH ST, NEW YORK, NY 10017 USA |
| ISBN Number | 978-1-7281-3286-0 |
| Mots-clés | Accuracy, Micro-assembly, Microrobotics, UV Glue Curing |
| Résumé | Positional drift resulted from the glue curing may result into serious challenges towards accuracy especially for micro-assembly processes. Studying forces and positional drifts resulted from the glue curing appears as a key objective towards reaching precise micro-assemblies. For this reason, works notably investigate the forces and displacements originated from the UV glue curing. Experimental investigations demonstrates that the force induced during the glue curing is in 160 mu N range against a micro-object with cross section of 500 x 500 mu m, and the corresponding positional drift in the 10 mu m range was obtained. Works also show that these values depend on the system and strategy used for the assembly. |