Stealth dicing with ultrafast Bessel beams with engineered transverse profiles
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Titre | Stealth dicing with ultrafast Bessel beams with engineered transverse profiles |
Type de publication | Conference Paper |
Year of Publication | 2017 |
Auteurs | Meyer R., Safioui J., Giust R., Lacourt P.-A, Furfaro L., Dudley J.M, Courvoisier F. |
Conference Name | 2017 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO) |
Publisher | IEEE |
Conference Location | 345 E 47TH ST, NEW YORK, NY 10017 USA |
ISBN Number | 978-1-9435-8027-9 |
Résumé | We investigate high-speed glass cleaving with ultrafast laser beams with engineered transverse intensity profile. We achieve accuracy of similar to 1 mu m at 25 mm/s and drastically enhance cleavability compared to standard Bessel beams. |