Detection of Out-of-Plane and In-Plane (XYZ) Motions of Piezoelectric Microcantilever by 3D-Laser Doppler Vibrometry
| Affiliation auteurs | !!!! Error affiliation !!!! |
| Titre | Detection of Out-of-Plane and In-Plane (XYZ) Motions of Piezoelectric Microcantilever by 3D-Laser Doppler Vibrometry |
| Type de publication | Conference Paper |
| Year of Publication | 2016 |
| Auteurs | Herth E, Lardet-Vieudrin F, Deux F, Valbin L, Algre E, Schell J, Steger H |
| Editor | Charlot B, Mita Y, Nouet P, Pressecq F, Rencz M, Schneider P, Tas N |
| Conference Name | 2016 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP) |
| Publisher | CMP; LIRMM; UMONTPELLIER; IEEE Components Packaging & Mfg Technol Soc; BME; BMEVIKING |
| Conference Location | 345 E 47TH ST, NEW YORK, NY 10017 USA |
| ISBN Number | 978-1-5090-1457-6 |
| Mots-clés | 3D displacement, Aliminum nitride, Laser Vibrometry Doppler, piezoelectric film |
| Résumé | This paper investigates the vibration analysis of microcantilever in the hnndred kHz to MHz range nsing 3D Vibrometry experimental tool. These microdevices have been actuated by a piezoelectric Aluminum Nitride (AIN) 1.5/t m-thin layer. Analytical and 3D finite element method (3D-FEM) analysis nsing Comsol software has been performed to model vibration behavior. Typical nnmerical simulations and experimental results are presented and discussed. We particularly emphasize on the high detection in-plane and out-of plane motions of the microcantilevers actnated piezoelectrically in air environment. The bending, torsion and lateral modes have been snccessfnlly demonstrated. The pnrpose of this article is to review these latest developments tools in the microcantilever dynamic measurement and present an ontlook of the fntnre of these characterization in the next generation microsystems. |