Network-on-Chip Especially for Video Coding Applications Using Multi-layer Mesh Topology

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TitreNetwork-on-Chip Especially for Video Coding Applications Using Multi-layer Mesh Topology
Type de publicationJournal Article
Year of Publication2019
AuteursMessaoudi K, Toumi S, Bourennane E-B
JournalRECENT ADVANCES IN ELECTRICAL & ELECTRONIC ENGINEERING
Volume12
Pagination247-256
Type of ArticleArticle
ISSN2352-0965
Mots-clésH.264/AVC codec, hardware IPs, mesh topology, MPSoC, Network-on-chip, System-on-Chip
Résumé

Background: Network on chip is proposed as new reusable and scalable communication system for applications with important number of IPs. The NoC architecture characteristics are based on several factors: the implementation strategy of IPs, the power dissipation, the placement of IPs, data transfer time, the requirements of the given application, etc. The NxM Mesh topology combined with the XY routing algorithm are generally chosen in many studies. Hardware IPs proposed in the literature, for various applications as example video encoders, operates at different frequencies and generally implemented according to several strategies and different bus sizes. Connecting these IPs using the same communication system is very difficult. Methods: In this paper, we present a new topology based on multi-layer mesh topology and adapted for video coding applications. The proposed topology exploits the video coding information regarding groups of cores that communicate through two cores only. The idea is to use a specific NoC for each group of cores and connect the NoCs with bridge in the positions of two communication cores. The choice of parameters in each NoC depends on the characteristic of IPs in the same group in order to maximize communication adaptivity and performance. Results: Synthesis results show that the proposed multi-layer mesh topology NoC uses much less resources than the traditional NxM mesh topology NoC. Conclusion: This reduction in term of resources is assured by the considerable reduction in the length and number of global interconnects, resulting in an increase in the performance and decrease in the power consumption and area of wire limited circuits.

DOI10.2174/2352096511666180525124330