Stealth dicing with ultrafast Bessel beams with engineered transverse profiles

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TitreStealth dicing with ultrafast Bessel beams with engineered transverse profiles
Type de publicationConference Paper
Year of Publication2017
AuteursMeyer R., Safioui J., Giust R., Lacourt P.-A, Furfaro L., Dudley J.M, Courvoisier F.
Conference Name2017 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)
PublisherIEEE
Conference Location345 E 47TH ST, NEW YORK, NY 10017 USA
ISBN Number978-1-9435-8027-9
Résumé

We investigate high-speed glass cleaving with ultrafast laser beams with engineered transverse intensity profile. We achieve accuracy of similar to 1 mu m at 25 mm/s and drastically enhance cleavability compared to standard Bessel beams.