Shear effect on dynamic behavior of microcantilever beam with manufacturing process defects

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TitreShear effect on dynamic behavior of microcantilever beam with manufacturing process defects
Type de publicationJournal Article
Year of Publication2017
AuteursBourouina H, Yahiaoui R, Yusifli E, Benamar MEl Amine, Ghoumid K, Herlem G
JournalMICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume23
Pagination2537-2542
Date PublishedJUL
Type of ArticleArticle
ISSN0946-7076
Résumé

This paper is concerned with the investigation of the shear effect on the dynamic behavior of a thin microcantilever beam with manufacturing process defects. Unlike the Rayleigh beam model (RBM), the Timoshenko beam model (TBM) takes in consideration the shear effect on the resonance frequency. This effect become significant for thin microcantilever beams with larger slenderness ratios that are normally encountered in MEMS devices such as sensors. The TBM model is presented and analyzed by numerical simulation using Finite Element Method (FEM) to determine corrective factors for the correction of the effect of manufacturing process defects like the under-etching at the clamped end of the microbeam and the non-rectangular cross section of the area. A semi-analytical approach is proposed for the extraction of the Young's modulus from 3D FEM simulation with COMSOL Multiphysics software. This model was tested on measurements of a thin chromium microcantilever beam of dimensions (80 x 2 x 0.95 mu m(3)). Final results indicate that the correction of the effect of manufacturing process defects is significant where the corrected value of Young's modulus is very close to the experimental results and it is about 280.81 GPa.

DOI10.1007/s00542-016-3078-x